US Patent Issued to SHINKO ELECTRIC INDUSTRIES on July 21 for "Wiring substrate, semiconductor device, and method of manufacturing the wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,477, issued on July 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Wiring substrate, semiconductor device, and method of manufacturing the wiring substrate" was invented by Kosuke Tsukamoto (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first insulating layer, a first wiring layer that is provided on the first insulating layer, and a thin film layer that is provided on one of surfaces of the first insulating layer and that includes a second insulating layer that is different from the first insulating layer and a second wiring layer. The thin film layer includes a first pad and a...