US Patent Issued to NXP USA on July 21 for "Packaged semiconductor device, leadframe and method for improved bonding" (Chinese, Malaysian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,469, issued on July 21, was assigned to NXP USA Inc. (Austin, Texas).

"Packaged semiconductor device, leadframe and method for improved bonding" was invented by You Ge (Tianjin, China), Zhijie Wang (Tianjin, China), Yit Meng Lee (Kuala Lumpur, Malaysia) and Yanbo Xu (Tianjin, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is disclosed a packaged semiconductor device comprising: a leadframe having a first thickness; the leadframe comprising a die pad; a semiconductor die thereabove; and epoxy therebetween and arranged to bond the semiconductor die to the die pad; wherein in at least one region under the semiconductor die, the die pad has ...