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US Patent Issued to Renesas Electronics on Sept. 8 for "Semiconductor device having chip capacitor connected to semiconductor chip with wires" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,183, issued on Sept. 8, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device having chip capacitor connected to semicon... और पढ़ें


US Patent Issued to FUJI ELECTRIC on Sept. 8 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,184, issued on Sept. 8, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Taichi Karino (Mat... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Integrated circuit device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,185, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device" was invented by J... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Metal-insulator-metal capacitors and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,186, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Metal-insulator-metal capacitor... और पढ़ें


US Patent Issued to UNITED MICROELECTRONICS on Sept. 8 for "Metal-insulator-metal capacitor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,187, issued on Sept. 8, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Metal-insulator-metal capacitor structure" ... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Method and structure for diodes with backside contacts" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,188, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method and structure for diodes... और पढ़ें


US Patent Issued to ROHM on Sept. 8 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,189, issued on Sept. 8, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Masaya Ueno (Kyoto, Japan). A... और पढ़ें


US Patent Issued to NEXPERIA on Sept. 8 for "Transfer device for transferring an electronic component" (German, Dutch Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,190, issued on Sept. 8, was assigned to NEXPERIA B.V. (Nijmegen, Netherlands). "Transfer device for transferring an electronic component" w... और पढ़ें


US Patent Issued to STMICROELECTRONICS on Sept. 8 for "Manufacturing process of an ohmic contact of a HEMT device and HEMT device" (Italian Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,191, issued on Sept. 8, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy). "Manufacturing process of an ohmic contact of a ... और पढ़ें


US Patent Issued to Silergy Semiconductor Technology (Hangzhou) on Sept. 8 for "Semiconductor device and method for manufacturing the same" (Chinese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,192, issued on Sept. 8, was assigned to Silergy Semiconductor Technology (Hangzhou) LTD. (Hangzhou, China). "Semiconductor device and metho... और पढ़ें