US Patent Issued to Renesas Electronics on Sept. 8 for "Semiconductor device having chip capacitor connected to semiconductor chip with wires" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,183, issued on Sept. 8, was assigned to Renesas Electronics Corp. (Tokyo).

"Semiconductor device having chip capacitor connected to semiconductor chip with wires" was invented by Kazuaki Tsuchiyama (Tokyo) and Tatsuaki Tsukuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a base material having a first terminal; a semiconductor chip having a first electrode pad electrically connected with the first terminal, a second electrode pad to which a power supply potential is to be supplied, and a third electrode pad to which a reference potential is to be supplied, and mounted on the base material via a first member;...