ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,215, issued on July 14, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Stacked layers with filling structures" was i... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,216, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Composite IC die package including IC die directly bonded to fr... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,217, issued on July 14, was assigned to Canon K.K. (Tokyo). "Semiconductor module manufacturing method, electronic equipment manufacturing ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,218, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Metal PCB for topside power delivery" was invented by Kyle Arri... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,219, issued on July 14, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a chiplet located between an integrated device and a... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,220, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Modular systems in packages, and associated devices, system... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,221, issued on July 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device with offset lower electrodes of ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,222, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architecture with memory chips having different process... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,223, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and manufacturing meth... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,224, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... और पढ़ें