US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,223, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and manufacturing method thereof" was invented by Kyungdon Mun (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package having a signal transfer path between semiconductor chips and a method of manufacturing the semiconductor package are provided. The semiconductor package includes a first redistribution substrate, a semiconductor chip stack arranged on the first redistribution substrate and including a lower chip and an upper chip, a through post arranged on the first redistribution substrate arou...