US Patent Issued to Micron Technology on July 14 for "Modular systems in packages, and associated devices, systems, and methods" (Singaporean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,220, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho).

"Modular systems in packages, and associated devices, systems, and methods" was invented by Kelvin Tan Aik Boo (Singapore), Hong Wan Ng (Singapore), Seng Kim Ye (Singapore) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Modular systems in packages, and associated devices, systems, and methods, are disclosed herein. In one embodiment, a system comprises a main module package and an upper module package. The main module package includes a first substrate and a first electronic device mounted on a first side of the first substrate. The upper mod...