US Patent Issued to Canon on July 14 for "Semiconductor module manufacturing method, electronic equipment manufacturing method, semiconductor module, and electronic equipment" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,217, issued on July 14, was assigned to Canon K.K. (Tokyo).

"Semiconductor module manufacturing method, electronic equipment manufacturing method, semiconductor module, and electronic equipment" was invented by Kana Onoko (Kanagawa, Japan) and Takashi Aoki (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip component including a first electrode and a second electrode, a semiconductor device including a first land a second land, and a printed wiring board are prepared. A first solder paste and a second solder paste are supplied to the printed wiring board. The chip component is placed on the printed wiring board so that the first elec...