US Patent Issued to Intel on July 14 for "Metal PCB for topside power delivery" (Arizona, Colorado, California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,218, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Metal PCB for topside power delivery" was invented by Kyle Arrington (Gilbert, Ariz.), Kuang Liu (Queen Creek, Ariz.), Bohan Shan (Chandler, Ariz.), Hongxia Feng (Chandler, Ariz.), Don Douglas Josephson (Fort Collins, Colo.), Stephen Morein (San Jose, Calif.) and Kaladhar Radhakrishnan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment,...