US Patent Issued to Intel on July 14 for "Composite IC die package including IC die directly bonded to front and back sides of an interposer" (Arizona Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,216, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Composite IC die package including IC die directly bonded to front and back sides of an interposer" was invented by Junxin Wang (Chandler, Ariz.) and Whitney Bryks (Tempe, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Composite IC die package including IC die on both a first and second side of an interposer. The backside of first IC die are attached, for example through a direct bond, to a first side of the interposer. Redistribution layer (RDL) metal features are then fabricated, for example with semi-additive processes (SAP), to form interconnects to the frontside o...