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US Patent Issued to Tokyo Electron on Sept. 29 for "Etching method, plasma processing apparatus, substrate processing system, and program" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,227, issued on Sept. 29, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching method, plasma processing apparatus, substrate processing s... Read More


US Patent Issued to BAKER HUGHES OILFIELD OPERATIONS on Sept. 29 for "Transducers including laser etched substrates" (German Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,228, issued on Sept. 29, was assigned to BAKER HUGHES OILFIELD OPERATIONS LLC (Houston). "Transducers including laser etched substrates" w... Read More


US Patent Issued to ASM IP Holding on Sept. 29 for "Methods and systems for topography-selective depositions" (Belgian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,229, issued on Sept. 29, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods and systems for topography-selective depositi... Read More


US Patent Issued to IonQ on Sept. 29 for "Photonic integrated circuit chip facet preparation via laser-based dicing" (Maryland, Massachusetts Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,230, issued on Sept. 29, was assigned to IonQ Inc. (College Park, Md.). "Photonic integrated circuit chip facet preparation via laser-base... Read More


US Patent Issued to UNITED MICROELECTRONICS on Sept. 29 for "Edge structure of semiconductor wafer and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,231, issued on Sept. 29, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Edge structure of semiconductor wafer and... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor transport system and method of transporting semiconductor" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,232, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor transport system and method ... Read More


US Patent Issued to KLA on Sept. 29 for "Method to perform in-situ vacuum contamination measurement and identification in arbitrarily large chambers" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,233, issued on Sept. 29, was assigned to KLA Corp. (Milpitas, Calif.). "Method to perform in-situ vacuum contamination measurement and ide... Read More


US Patent Issued to VM on Sept. 29 for "Spraying nozzle type of an apparatus for removing a residual gas on a wafer" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,234, issued on Sept. 29, was assigned to VM INC. (Icheon-si, South Korea). "Spraying nozzle type of an apparatus for removing a residual g... Read More


US Patent Issued to Kokusai Electric on Sept. 29 for "Gas supply system, substrate processing apparatus and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,235, issued on Sept. 29, was assigned to Kokusai Electric Corp. (Tokyo). "Gas supply system, substrate processing apparatus and method of ... Read More


US Patent Issued to Applied Materials on Sept. 29 for "Temperature control system with flammable heat transfer fluid" (Indian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,236, issued on Sept. 29, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Temperature control system with flammable heat tra... Read More