US Patent Issued to VM on Sept. 29 for "Spraying nozzle type of an apparatus for removing a residual gas on a wafer" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,234, issued on Sept. 29, was assigned to VM INC. (Icheon-si, South Korea).

"Spraying nozzle type of an apparatus for removing a residual gas on a wafer" was invented by Hwi Gon Jang (Yongin-si, South Korea), Woo Hyung Choi (Seongnam-si, South Korea), Byeong Jun Jung (Icheon-si, South Korea) and Jin Myeong Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for removing a residual gas on a wafer comprises at least one spraying nozzle disposed at a front of a loading volume formed within a housing and extending linearly along a horizontal direction respectively; and a plurality of spraying holes formed at each spra...