US Patent Issued to IonQ on Sept. 29 for "Photonic integrated circuit chip facet preparation via laser-based dicing" (Maryland, Massachusetts Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,230, issued on Sept. 29, was assigned to IonQ Inc. (College Park, Md.).

"Photonic integrated circuit chip facet preparation via laser-based dicing" was invented by Alex Yulaev (Germantown, Md.), James Walker Steere (College Park, Md.), Kang Tan (College Park, Md.) and Jeremy Matthew Sage (Acton, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure relate generally to systems and methods for use in the implementation and/or operation of preparing photonic integrated circuits (PICs). Specifically, the method include coupling a dicing tape to a first side of a wafer. The method also includes performing a first laser p...