US Patent Issued to UNITED MICROELECTRONICS on Sept. 29 for "Edge structure of semiconductor wafer and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,231, issued on Sept. 29, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Edge structure of semiconductor wafer and manufacturing method thereof" was invented by Yu-Ping Wang (Hsinchu City, Taiwan), Chuan-Lan Lin (Chiayi City, Taiwan), Chu-Fu Lin (Kaohsiung City, Taiwan), Teng-Chuan Hu (Tainan City, Taiwan) and Kun-Ju Li (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provide an edge structure of a semiconductor wafer, which comprise a first substrate, an edge region and a device region are defined on that first substrate, a first material layer covers a first surface and a side surface of th...