US Patent Issued to CHIPMORE TECHNOLOGY, HEFEI CHIPMORE TECHNOLOGY on April 7 for "Chip packaging method involving fabrication of wire bond and electroplated metal bonding pad through formation of metal gasket, passivation layer, metal seed layer, and photoresist" (Chinese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,025, issued on April 7, was assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED (Suzhou, China) and HEFEI CHIPMORE TECHNOLOGY Co. LTD. (Heif... और पढ़ें

US Patent Issued to Micron Technology on April 7 for "Semiconductor packages with patterns of die-specific information" (Italian Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,026, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor packages with patterns of die-specific inform... और पढ़ें

US Patent Issued to HITACHI ASTEMO on April 7 for "Electric circuit body and power conversion device" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,027, issued on April 7, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan). "Electric circuit body and power conversion device" was i... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor packages having adhesive members" (South Korean Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,028, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages having adhesive membe... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Package structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,029, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of for... और पढ़ें

US Patent Issued to Siemens on April 7 for "Power semiconductor module system and method for producing the power semiconductor module system" (German Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,030, issued on April 7, was assigned to Siemens AG (Munich). "Power semiconductor module system and method for producing the power semicond... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Semiconductor package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,031, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method" w... और पढ़ें

US Patent Issued to Intel on April 7 for "Bilayer memory stacking with lines shared between bottom and top memory layers" (Oregon Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,032, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Bilayer memory stacking with lines shared between bottom and to... और पढ़ें

US Patent Issued to Intel on April 7 for "Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializer" (California, Oregon, Massachusetts, Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,033, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Quasi-monolithic integrated packaging architecture with mid-die... और पढ़ें

US Patent Issued to Intel on April 7 for "Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposer" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,034, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic structure including active base substrate with ... और पढ़ें

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