US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor packages having adhesive members" (South Korean Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,028, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packages having adhesive members" was invented by Jooyoung Oh (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a first semiconductor chip and a second semiconductor chip sequentially stacked on the package substrate, the first semiconductor chip and the second semiconductor chip being disposed in a form of an offset stack structure, and the second semiconductor chip including an overhang further protruding beyond a side surface of the first semiconductor chip in a fir...