US Patent Issued to Siemens on April 7 for "Power semiconductor module system and method for producing the power semiconductor module system" (German Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,030, issued on April 7, was assigned to Siemens AG (Munich).

"Power semiconductor module system and method for producing the power semiconductor module system" was invented by Roland Lorz (Rottenbach, Germany) and Philipp KneiBl (Nuremberg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a power semiconductor module system includes producing a first and second power semiconductor modules that each have a power semiconductor circuit, connecting first and second contact electrodes to the respective power semiconductor circuits, and partially enclosing the power semiconductor modules in a common housing, wherein the first ...