US Patent Issued to CHIPMORE TECHNOLOGY, HEFEI CHIPMORE TECHNOLOGY on April 7 for "Chip packaging method involving fabrication of wire bond and electroplated metal bonding pad through formation of metal gasket, passivation layer, metal seed layer, and photoresist" (Chinese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,025, issued on April 7, was assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED (Suzhou, China) and HEFEI CHIPMORE TECHNOLOGY Co. LTD. (Heifei, China).

"Chip packaging method involving fabrication of wire bond and electroplated metal bonding pad through formation of metal gasket, passivation layer, metal seed layer, and photoresist" was invented by Wenjie Huang (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a chip packaging structure and a chip packaging method. The chip packaging structure includes a substrate, a metal bonding pad disposed on the substrate and a metal wire, wherein the tail end of the m...