US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Semiconductor package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,031, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method" was invented by Jian-You Chen (Hsinchu, Taiwan), Kuan-Yu Huang (Taipei, Taiwan), Li-Chung Kuo (Taipei City, Taiwan), Chen-Hsuan Tsai (Taitung City, Taiwan), Kung-Chen Yeh (Taichung City, Taiwan), Hsien-Ju Tsou (Taipei, Taiwan), Ying-Ching Shih (Hsinchu, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded...