US Patent Issued to Intel on April 7 for "Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializer" (California, Oregon, Massachusetts, Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,033, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializer" was invented by Gerald S. Pasdast (San Jose, Calif.), Adel A. Elsherbini (Tempe, Ariz.), Nevine Nassif (Arlington, Mass.), Carleton L. Molnar (Northborough, Mass.), Vivek Kumar Rajan (Portland, Ore.), Peipei Wang (San Jose, Calif.), Shawna M. Liff (Scottsdale, Ariz.), Tejpal Singh (Shrewsbury, Mass.) and Johanna M. Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly is provided, comprising: a first integrated circuit (IC) die having a first c...