US Patent Issued to Micron Technology on April 7 for "Semiconductor packages with patterns of die-specific information" (Italian Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,026, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor packages with patterns of die-specific information" was invented by Federico Pio (Brugherio, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas r...