US Patent Issued to LG INNOTEK on June 30 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,228, issued on June 30, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package comprising same"... Read More

US Patent Issued to INTERNATIONAL BUSINESS MACHINES on June 30 for "Tamper-respondent assemblies with individualized chemical mixtures for security" (New York, Connecticut, Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,229, issued on June 30, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Tamper-respondent assemblies with individual... Read More

US Patent Issued to DAIKIN INDUSTRIES on June 30 for "Substrate structure" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,230, issued on June 30, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan). "Substrate structure" was invented by Kazuma Tanimukai (Osak... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on June 30 for "Printed circuit board and substrate including electronic component embedded therein" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,231, issued on June 30, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and substrate in... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on June 30 for "Printed circuit board and method for making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,232, issued on June 30, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Printed circuit board and method for ... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on June 30 for "Printed circuit board and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,233, issued on June 30, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and manufacturin... Read More

US Patent Issued to ROBERT BOSCH on June 30 for "Connecting arrangement" (German Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,234, issued on June 30, was assigned to ROBERT BOSCH GMBH (Stuttgart, Germany). "Connecting arrangement" was invented by Guenter Gera (Leon... Read More

US Patent Issued to DexCom on June 30 for "Sensor interposer employing castellated through-vias" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,235, issued on June 30, was assigned to DexCom Inc. (San Diego). "Sensor interposer employing castellated through-vias" was invented by Sea... Read More

US Patent Issued to AT&S Austria Technologie & Systemtechnik on June 30 for "Component carrier with protruding portions and manufacturing method" (Chinese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,236, issued on June 30, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Component carrier with protruding p... Read More

US Patent Issued to LG Display on June 30 for "Display apparatus" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,237, issued on June 30, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display apparatus" was invented by Minwoo Kim (Paju-si, ... Read More

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