US Patent Issued to SAMSUNG ELECTRO-MECHANICS on June 30 for "Printed circuit board and substrate including electronic component embedded therein" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,231, issued on June 30, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board and substrate including electronic component embedded therein" was invented by Dae Jung Byun (Suwon-si, South Korea), Mi Sun Hwang (Suwon-si, South Korea), Jung Soo Kim (Suwon-si, South Korea), Jin Won Lee (Suwon-si, South Korea) and Duck Young Maeng (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second i...