US Patent Issued to DAIKIN INDUSTRIES on June 30 for "Substrate structure" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,230, issued on June 30, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan).

"Substrate structure" was invented by Kazuma Tanimukai (Osaka, Japan), Masaki Kono (Osaka, Japan), Hirotaka Doi (Osaka, Japan), Reiji Kawashima (Osaka, Japan) and Yuki Nakajima (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure includes a first substrate with a plurality of chip parts including a first chip part mounted, and a second substrate connected to the first substrate. The first chip part has a strain equal to or more than a predetermined value, which is from 500 MuST to 4000 MuST, in a non-connected state in which the second substr...