ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,233, issued on June 30, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and manufacturing method thereof" was invented by Jun Ki Min (Suwon-si, South Korea) and Seong Ho Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board according to an embodiment includes: an insulation layer including a recess portion; and a connection pad disposed on the recess portion of the insulation layer and protruded from the recess portion, wherein the connection pad may include a protrusion and a concave portion that is lower than the protrusion, and a surface height of the ...