US Patent Issued to LG INNOTEK on June 30 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,228, issued on June 30, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package comprising same" was invented by Myung Jae Kwon (Seoul, South Korea), Sang Hyuck Nam (Seoul, South Korea) and Sang Hyun Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and having a width narrower than that of the first insulating layer; wherein an upper surface of the first insulating layer includes...