ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,236, issued on June 30, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria).

"Component carrier with protruding portions and manufacturing method" was invented by Minwoo Lee (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A coreless component carrier includes a stack with at least two electrically conductive layer structures and at least one electrically insulating layer structure, vias that vertically interconnect the electrically conductive layer structures in the stack, and protruding portions that protrude from the outermost electrically conductive layer structure of the stack beyond the upper main surf...