US Patent Issued to DexCom on June 30 for "Sensor interposer employing castellated through-vias" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,235, issued on June 30, was assigned to DexCom Inc. (San Diego).

"Sensor interposer employing castellated through-vias" was invented by Sean Frick (San Francisco), Louis Jung (Foster City, Calif.) and David Lari (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellate...