US Patent Issued to SILICONWARE PRECISION INDUSTRIES on April 21 for "Working system for semiconductor packaging process and operation method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,779, issued on April 21, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Working system for semiconduc... Read More

US Patent Issued to Kulicke and Soffa Industries on April 21 for "Bonding systems using a predetermined tilt profile" (Pennsylvania Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,780, issued on April 21, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Bonding systems using a predetermined ... Read More

US Patent Issued to ASML NETHERLANDS on April 21 for "Base plate and substrate assembly" (Dutch Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,781, issued on April 21, was assigned to ASML NETHERLANDS B.V. (Veldhoven, Netherlands). "Base plate and substrate assembly" was invented ... Read More

US Patent Issued to SEMES on April 21 for "Support unit and apparatus for treating substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,782, issued on April 21, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Support unit and apparatus for treating substra... Read More

US Patent Issued to Tokyo Electron on April 21 for "Substrate transfer apparatus, state determination method, and computer storage medium" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,783, issued on April 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer apparatus, state determination method, and compu... Read More

US Patent Issued to Canon on April 21 for "Systems, devices, and methods for registering a superstrate of an imprint tool" (Texas Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,784, issued on April 21, was assigned to Canon K.K. (Tokyo). "Systems, devices, and methods for registering a superstrate of an imprint to... Read More

US Patent Issued to HITACHI on April 21 for "Semiconductor device and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,785, issued on April 21, was assigned to HITACHI LTD. (Tokyo). "Semiconductor device and method for manufacturing the same" was invented b... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on April 21 for "Semiconductor layout structure and semiconductor test structure" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,786, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor layout structure and semico... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Asymmetric pads structure and test element group module" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,787, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Asymmetric pads structure and test element gro... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on April 21 for "Method of processing photoresist layer, and photoresist layer" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,788, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Method of processing photoresist layer, a... Read More

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