US Patent Issued to Electronics and Telecommunications Research Institute on May 19 for "Method and device for determining reference unit" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,634,499, issued on May 19, was assigned to Electronics and Telecommunications Research Institute (Daejeon, South Korea). "Method and device for ... Read More

US Patent Issued to Semiconductor Manufacturing International (Tianjin), Semiconductor Manufacturing International (Shanghai) on May 19 for "Semiconductor structure and fabrication method thereof" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,512, issued on May 19, was assigned to Semiconductor Manufacturing International (Tianjin) Corp. (Tianjin, China) and Semiconductor Manufactu... Read More

US Patent Issued to International Business Machines on May 19 for "Interconnect structure with increased decoupling capacitance" (New York, New Hampshire Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,513, issued on May 19, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect structure with increased decoupli... Read More

US Patent Issued to INTERNATIONAL BUSINESS MACHINES on May 19 for "Metal insulator metal capacitor (MIM capacitor)" (New York, Utah Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,514, issued on May 19, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Metal insulator metal capacitor (MIM capacitor... Read More

US Patent Issued to HITACHI ENERGY on May 19 for "Semiconductor power device, semiconductor power system and method for cooling a semiconductor power device" (Swiss Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,515, issued on May 19, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland). "Semiconductor power device, semiconductor power system and... Read More

US Patent Issued to Mitsubishi Electric on May 19 for "Semiconductor device with enhanced bonding, method of manufacturing same, and power conversion device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,516, issued on May 19, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device with enhanced bonding, method of manufacturi... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on May 19 for "Dual-side heat-dissipation package structure and package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,517, issued on May 19, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Dual-side heat-dissipation package stru... Read More

US Patent Issued to DENSO on May 19 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,518, issued on May 19, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Motomi Murozaki (Kariya-city... Read More

US Patent Issued to ROBERT BOSCH on May 19 for "Device comprising a ceramic substrate and method for producing same" (German Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,519, issued on May 19, was assigned to ROBERT BOSCH GMBH (Stuttgart, Germany). "Device comprising a ceramic substrate and method for produci... Read More

US Patent Issued to Tamura, Novel Crystal Technology on May 19 for "Semiconductor element, method for manufacturing semiconductor element, semiconductor device, and method for manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,520, issued on May 19, was assigned to Tamura Corp. (Tokyo) and Novel Crystal Technology Inc. (Saitama, Japan). "Semiconductor element, meth... Read More

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