ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,520, issued on May 19, was assigned to Tamura Corp. (Tokyo) and Novel Crystal Technology Inc. (Saitama, Japan).

"Semiconductor element, method for manufacturing semiconductor element, semiconductor device, and method for manufacturing semiconductor device" was invented by Nobuo Machida (Sayama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor element includes preparing a semiconductor wafer that includes a substrate including a Ga2O3-based semiconductor and an epitaxial layer including a Ga2O3-based semiconductor and located on the substrate, fixing the epitaxial layer side of the semiconductor wafer to ...