US Patent Issued to HITACHI ENERGY on May 19 for "Semiconductor power device, semiconductor power system and method for cooling a semiconductor power device" (Swiss Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,515, issued on May 19, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland).

"Semiconductor power device, semiconductor power system and method for cooling a semiconductor power device" was invented by Lluis Santolaria (Olten, Switzerland), Milad Maleki (Untersiggenthal, Switzerland) and Fabian Fischer (Baden, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A effective lower flow direction comprises power module and a housing that is arranged on an upper surface of the power module defining an upper flow section for liquid cooling of the power module in between. The upper flow section comprises an inlet, an outlet and a given upper flo...