US Patent Issued to Mitsubishi Electric on May 19 for "Semiconductor device with enhanced bonding, method of manufacturing same, and power conversion device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,516, issued on May 19, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device with enhanced bonding, method of manufacturing same, and power conversion device" was invented by Yasunari Hino (Tokyo), Yasuo Tanaka (Tokyo) and Shinnosuke Soda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor device with a bonding strength ensured between an electrode of a semiconductor element and a terminal, and a power conversion device including the semiconductor device. A semiconductor device includes: a semiconductor element having an electrode; a substrate; a terminal; and a bonding material. The terminal has a th...