US Patent Issued to FUJI ELECTRIC on July 14 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,049, issued on July 14, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan). "Semiconductor device and manufacturing method of semicon... Read More

US Patent Issued to Applied Materials on July 14 for "Methods and apparatus for processing a substrate" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,050, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and apparatus for processing a substrate" wa... Read More

US Patent Issued to Resonac on July 14 for "Etching gas, etching method, and method for producing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,051, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Etching gas, etching method, and method for producing semiconductor device"... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Low pressure plasma etch process for preferential generation of oxide residue and applications for the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,052, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Low pressure plasma etch process fo... Read More

US Patent Issued to Hitachi High-Tech on July 14 for "Plasma processing method" (American, Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,053, issued on July 14, was assigned to Hitachi High-Tech Corp. (Tokyo). "Plasma processing method" was invented by Yohei Ishii (Hillsboro,... Read More

US Patent Issued to Tokyo Electron on July 14 for "Plasma processing method and plasma processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,054, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing method and plasma processing system" was invented b... Read More

US Patent Issued to Tokyo Electron on July 14 for "Semiconductor devices and methods of manufacturing the same" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,055, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor devices and methods of manufacturing the same" was inve... Read More

US Patent Issued to SCREEN Holdings on July 14 for "Substrate treating method and substrate treating apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,056, issued on July 14, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treating method and substrate treating apparatu... Read More

US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on July 14 for "Semiconductor device and method of forming thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,057, issued on July 14, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Semiconductor device and method of forming th... Read More

US Patent Issued to FUJIFILM on July 14 for "Polishing liquid and chemical mechanical polishing method" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,058, issued on July 14, was assigned to FUJIFILM Corp. (Tokyo). "Polishing liquid and chemical mechanical polishing method" was invented by... Read More

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