ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,056, issued on July 14, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate treating method and substrate treating apparatus" was invented by Yosuke Hanawa (Kyoto, Japan), Dai Ueda (Kyoto, Japan) and Akiko Harumoto (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to a substrate treating method and a substrate treating apparatus. An additive is dissolved in a first treatment liquid. The first treatment liquid contains iodide ions (I-). The substrate treating method includes an adjusting step and a supplying step. In the adjusting step, decrease in iodide ions (I-) contained in the first treatment li...