ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,058, issued on July 14, was assigned to FUJIFILM Corp. (Tokyo).
"Polishing liquid and chemical mechanical polishing method" was invented by Tetsuya Kamimura (Shizuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a polishing liquid which reduces the occurrence of dishing on a surface to be polished of an object to be polished having a cobalt-containing film after polishing in a case where the polishing liquid is applied to CMP of the object to be polished. In addition, another object of the present invention is to provide a chemical mechanical polishing method using the above-mentioned polishi...