US Patent Issued to NANYA TECHNOLOGY on July 14 for "Method for preparing semiconductor device with air spacer" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,142, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method for preparing semiconductor device with a... Read More

US Patent Issued to GlobalFoundries Singapore on July 14 for "Semiconductor devices including an air gap adjacent to an interconnect structure and methods of forming the same" (Singaporean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,143, issued on July 14, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Semiconductor devices including an air gap adjace... Read More

US Patent Issued to NANYA TECHNOLOGY on July 14 for "Semiconductor device with filling layer" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,144, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Semiconductor device with filling layer" was invented... Read More

US Patent Issued to NANYA TECHNOLOGY on July 14 for "Semiconductor device with filling layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,145, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with filling layer and meth... Read More

US Patent Issued to Fujitsu on July 14 for "Semiconductor device, amplifying device, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,146, issued on July 14, was assigned to Fujitsu Ltd. (Kawasaki, Japan). "Semiconductor device, amplifying device, and method of manufacturi... Read More

US Patent Issued to GLOBALFOUNDRIES Singapore on July 14 for "Active region electrically programmable fuse with gate structure as silicide block" (Singaporean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,147, issued on July 14, was assigned to GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore). "Active region electrically programmable fuse with... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Dummy metal-insulator-metal structures within vias" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,148, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Dummy metal-insulator-metal str... Read More

US Patent Issued to Qorvo US on July 14 for "Delamination/cracking improvement at solder joints in microelectronics package" (Texas, Florida Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,205, issued on July 14, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Delamination/cracking improvement at solder joints in microelect... Read More

US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Semiconductor device package with wettable flanks" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,207, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor device package with wettable flanks" was invented b... Read More

US Patent Issued to Resonac on July 14 for "Method for manufacturing semiconductor device including disposing an adhesive thermal insulation material on the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,208, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Method for manufacturing semiconductor device including disposing an adhesi... Read More

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