US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Semiconductor device package with wettable flanks" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,207, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor device package with wettable flanks" was invented by Yu Fu (Huizhou City, China), Huo Yun Duan (Chengdu, China), Fu Ren Pang (Chengdu, China), Longting Li (Chengdu, China) and Zheng Qing Fan (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an example no-lead semiconductor device package includes: a die pad in a central portion of a partially etched leadframe and terminals. The terminals include a device side surface formed in an upper layer of the partially etched leadframe, and a first exterior end in the upper layer; a boar...