US Patent Issued to ASM IP Holding on June 23 for "Method of depositing condensable material onto a surface of a substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,890, issued on June 23, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of depositing condensable material onto a surfac... Read More

US Patent Issued to Applied Materials on June 23 for "Area selective carbon-based film deposition" (Singaporean, American Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,891, issued on June 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Area selective carbon-based film deposition" was inv... Read More

US Patent Issued to Tokyo Electron on June 23 for "Method for ion-assisted self-limited conformal etch" (American, Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,892, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for ion-assisted self-limited conformal etch" was invented by ... Read More

US Patent Issued to Tokyo Electron on June 23 for "Sidewall inorganic passivation for dielectric etching via surface modification" (New York Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,893, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Sidewall inorganic passivation for dielectric etching via surface mod... Read More

US Patent Issued to Tokyo Electron on June 23 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,894, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More

US Patent Issued to Infineon Technologies on June 23 for "Method for forming semiconductor devices using a glass structure attached to a wide band-gap semiconductor wafer" (Austrian, German Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,895, issued on June 23, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Method for forming semiconductor devices using a gl... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "Vent port diffuser" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,896, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Vent port diffuser" was invented by... Read More

US Patent Issued to Applied Materials on June 23 for "Pre-clean chamber assembly architecture for improved serviceability" (Indian, American Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,897, issued on June 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Pre-clean chamber assembly architecture for improved... Read More

US Patent Issued to Lam Research on June 23 for "Gas box with cross-flow exhaust system" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,898, issued on June 23, was assigned to Lam Research Corp. (Fremont, Calif.). "Gas box with cross-flow exhaust system" was invented by Evan... Read More

US Patent Issued to Tokyo Electron on June 23 for "Wafer cleaning method and system" (New York Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,899, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Wafer cleaning method and system" was invented by James Grootegoed (A... Read More

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