ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,919, issued on Oct. 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with protection layer and m... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,920, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices with integrat... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,921, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "MIM flux capacitor with thin and thick metal levels" was invented... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,922, issued on Oct. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Power supply circuit module" was invented by Takami ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,923, issued on Oct. 27, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus for implementing capacitors in semiconduc... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,924, issued on Oct. 27, was assigned to GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore). "Capacitors with floating metal layers" was invent... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,925, issued on Oct. 27, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device, semiconductor module, motor drive device, and ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,926, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea). "Semiconductor package" was invented by Ge... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,927, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages having heat dissipati... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,928, issued on Oct. 27, was assigned to Siemens AG (Munich). "Electronics assembly comprising circuit carrier, semiconductor chip and heat ... Read More