US Patent Issued to Intel on Oct. 27 for "Methods and apparatus for implementing capacitors in semiconductor devices" (German, American Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,923, issued on Oct. 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus for implementing capacitors in semiconductor devices" was invented by Michael Langenbuch (Munich), Carla Moran Guizan (Munich), Mamatha Yakkegondi Virupakshappa (Munich), Roshini Sachithanandan (Munich), Philipp Riess (Munich), Jonathan Jensen (Greenville, S.C.), Peter Baumgartner (Munich) and Georg Seidemann (Landshut, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus are disclosed for implementing capacitors in semiconductor devices. An example semiconductor die includes a first dielectric material disposed between a first m...