US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor packages having heat dissipation pillars" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,927, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packages having heat dissipation pillars" was invented by Seokgeun Ahn (Suwon-si, South Korea), Cheol Kim (Suwon-si, South Korea) and Hwanyoung Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower redistribution structure, a first semiconductor chip and a second semiconductor chip that stacked on the lower redistribution structure, the second semiconductor chip including a heat dissipation pad disposed at an upper surface of the second semiconductor chip, a lower conductive pillar...