US Patent Issued to Siemens on Oct. 27 for "Electronics assembly comprising circuit carrier, semiconductor chip and heat sink" (German Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,928, issued on Oct. 27, was assigned to Siemens AG (Munich).

"Electronics assembly comprising circuit carrier, semiconductor chip and heat sink" was invented by Stefan Stegmeier (Munich), Heinz Wollmer (Ammerthal, Germany), Wolfgang Feil (Schwandorf, Germany), Karl-Heinz Schaller (Ursensollen, Germany) and Stefan Kiefl (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the teachings herein include an electronics assembly comprising: a circuit carrier; a semiconductor chip mounted on the circuit carrier; and a heat sink. The circuit carrier and the semiconductor chip each have a planar basic shape extending along parallel p...