ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,879, issued on Oct. 27, was assigned to EBARA Corp. (Tokyo). "Substrate processing apparatus" was invented by Akihiro Yazawa (Tokyo), Hirot... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,880, issued on Oct. 27, was assigned to FOREHOPE ELECTRONIC (NINGBO) Co. LTD. (Ningbo City, China). "Preparation method of fan-in package s... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,881, issued on Oct. 27, was assigned to Tokyo Electron Ltd. (Tokyo). "Systems and methods for determining a localized fluid velocity of a p... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,882, issued on Oct. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Substrate carrier detection using contactless commun... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,883, issued on Oct. 27, was assigned to KWANSEI GAKUIN EDUCATIONAL FOUNDATION (Hyogo, Japan), TOYO ALUMINIUM K.K. (Osaka, Japan) and TOYOTA ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,884, issued on Oct. 27, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor inspection apparatus and semiconductor manufactur... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,885, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wafer cleaning apparatus and wafer cleaning ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,886, issued on Oct. 27, was assigned to Entegris Inc. (Billerica, Mass.). "Substrate container, and door locking mechanism thereof" was inv... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,887, issued on Oct. 27, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo). "Method for carrying wafer and wafer-carrying apparatus" was i... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,888, issued on Oct. 27, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Centering device and substrate processing apparatus" was ... Read More