US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Wafer cleaning apparatus and wafer cleaning system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,885, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer cleaning apparatus and wafer cleaning system including the same" was invented by Tae Woong Um (Suwon-si, South Korea), Young Ju Kwon (Suwon-si, South Korea), Seung Won Yoon (Suwon-si, South Korea), Gu Ryung Jung (Suwon-si, South Korea), Seung Pyo Hong (Suwon-si, South Korea) and Sung Hyup Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer cleaning apparatus and a semiconductor manufacturing process are provided. The wafer cleaning apparatus comprising a plate extending in a first direction, a connecting part which is di...