US Patent Issued to FOREHOPE ELECTRONIC (NINGBO) on Oct. 27 for "Preparation method of fan-in package structure, and fan-in package structure" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,880, issued on Oct. 27, was assigned to FOREHOPE ELECTRONIC (NINGBO) Co. LTD. (Ningbo City, China).

"Preparation method of fan-in package structure, and fan-in package structure" was invented by Zhenghong He (Ningbo City, China) and Chao Zhang (Ningbo City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a preparation method of a fan-in package structure and a fan-in package structure, relating to the technical field of semiconductor packaging. In this method, holes are provided in an edge region of a wafer, a conductive metal is deposited to form metal posts, then after a protective layer and a first dielectric ...