ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,887, issued on Oct. 27, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).
"Method for carrying wafer and wafer-carrying apparatus" was invented by Seiji Satoh (Annaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is a method for carrying a wafer, wherein in taking out the wafer from a closed container and carrying the wafer by a carrier robot or in taking in the wafer carried by the carrier robot into the closed container, when a latchkey is rotationally driven for fixing and unfixing a lid relative to a container body of the closed container mounted on a load port frame by a latchkey-driving mechanism provided on a ...