US Patent Issued to EBARA on Oct. 27 for "Substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,879, issued on Oct. 27, was assigned to EBARA Corp. (Tokyo).

"Substrate processing apparatus" was invented by Akihiro Yazawa (Tokyo), Hirotaka Ohashi (Tokyo) and Yasuyuki Miyasawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a substrate processing apparatus for processing a substrate. The substrate processing apparatus (10) at least one first processing module (21a, 21b) configured to process a substrate W using a liquid; at least one second processing module (31) configured to process the substrate W that has been processed by the first processing module (21a, 21b); a transfer robot (22) which is placed in ...