ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,933, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Low resistance liner" was invented by Tek Po Rinus Lee (Albany, N.Y.)... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,934, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Method of via filling" was invented by Ryota Yonezawa (Albany, N.Y.),... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,935, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Implantation through an etch stop layer" was invented by Moshe ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,936, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device including gate con... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,937, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor cell architecture including ba... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,938, issued on June 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "TSV structure and fabricating method of the... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,939, issued on June 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and fabrication met... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,940, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,941, issued on June 23, was assigned to Wolfspeed Inc. (Durham, N.C.). "Interconnect metal openings through dielectric films" was invented ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,942, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices with active r... Read More