US Patent Issued to Wolfspeed on June 23 for "Interconnect metal openings through dielectric films" (North Carolina Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,941, issued on June 23, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Interconnect metal openings through dielectric films" was invented by Christopher Hardiman (Morrisville, N.C.), Daniel Namishia (Wake Forest, N.C.), Kyle Bothe (Cary, N.C.), Elizabeth Keenan (Cary, N.C.), David Santa Ana (Durham, N.C.) and Daniel Etter (Durham, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes a semiconductor body having a gate, a source contact, and a drain contact thereon, a metal contact structure on the semiconductor body and electrically connected to the gate, the source contact, or the drain contact, and an encapsulation stru...